All accepted abstracts will be published in the ISE 2019 abstract book.
A number of selected papers will be published in a Special Issue of the IEEE Transactions on Dielectrics and Electrical Insulation: Electrets and Related Phenomena, which is a highly prestigious and the flagship publication of IEEE Dielectrics and Electrical Insulation Society (DEIS).
The scope of the journal includes:
- Dielectric phenomena and measurements (to analyze these phenomena);
- Development and characterization of vacuum, gaseous, liquid and solid dielectrics and electrical insulating components of systems;
- Investigation of dielectric properties for innovative use including functional dielectrics;
- Diagnostic and prognostic methods with a primary focus on the behavior and properties of the electrical insulation in devices under operational stresses (the description of diagnostic methods without a primary link to the dielectric phenomena studied does not belong in these Transactions).
Electret related papers fall within the scope of this journal and can include, but not limited to,
- Charge related phenomena in dielectrics (injection, storage, transport, trapping, measurements)
- Dielectric and space charge relaxations in polymers and organics
- Dielectric and electrical responses of dielectrics to high electric fields
- Dielectric relaxation spectroscopy
- Energy storage in dielectrics and ionic materials
- Thermally stimulated phenomena
- Electrets for energy harvesting: principle, design, characterization and applications
- Piezo-, pyro- and ferroelectrets
- Electrocaloric and pyroelectric materials
- Piezoelectric phenomena in polymers and organics/biomaterials
- Applications of organic and polymer based piezoelectric materials
- Electrets and functional polymers in organic electronics
- Optical effects, photoelectrets
- Electrostatic and dielectric phenomena in life sciences – bioelectrets
- Soft transducers: sensors and actuators, including dielectric elastomers
- Nanoscale electrostatic, dielectric and electret materials
- Electret and dielectric phenomena in nanoscale structures
- Bioelectrets and bioapplications
- Electrets and additive manufacturing
- Characterisation of electrets and related devices
Submission to Special Issue:
Presenters of papers at the IEEE 17th International Symposium on Electrets (ISE 2019) are invited to submit their full paper to the special issue of the IEEE Transactions on Dielectrics and Electrical Insulation: Electrets and Related Phenomena. The Guest Editors for this special issue are: Professor Sidney Lang (email@example.com), Professor Axel Mellinger (firstname.lastname@example.org) and Professor Syed Tofail (email@example.com).
Authors will be invited to submit their papers to the Guest Editors of the Special Issue no later than July 31, 2019, at the TDEI website (http://www.cloznet.com/ieeetdei). On the submission form there is a location for Special Issue paper submission where the name of the Guest Editor can be chosen. Instructions for the preparation of manuscripts and a template are available at the website or directly from http://www.cloznet.com/ieeetdei/TDEI%20Template.docx
The template contains the formatting information etc. Specifically, papers are limited to 8 pages, 25 references, and files not more than about 12 Mb. Papers must follow the template to be accepted for peer review. The template can be downloaded from the paper submissions page.
In accordance with IEEE policy, papers that have been previously published in any conference proceedings cannot be republished. A plagiarism tool will be used to verify originality. Prospective authors of the ISE 2019 proceedings must significantly expand and enhance their conference abstracts to be considered for publication in this Special Issue of the IEEE TDEI.
Further questions concerning this Special Issue should be directed to
either one of the two Guest Editors or directly to the Editor-in-Chief of the
IEEE Transactions on Dielectrics and Electrical Insulation, Professor Edward Cherney (firstname.lastname@example.org). The Guest Editors for
this special issue are: Professor Sidney Lang (email@example.com), Professor Axel Mellinger
(firstname.lastname@example.org) and Professor Tofail Syed