Abstract book:

All accepted abstracts will be published in the ISE 2019 abstract book.

Special Issue:

A number of selected papers will be published in a Special Issue of the IEEE Transactions on Dielectrics and Electrical Insulation: Electrets and Related Phenomena, which is a highly prestigious and the flagship publication of IEEE Dielectrics and Electrical Insulation Society (DEIS).

The scope of the journal includes:

  • Dielectric phenomena and measurements (to analyze these phenomena);
  • Development and characterization of vacuum, gaseous, liquid and solid dielectrics and electrical insulating components of systems;
  • Investigation of dielectric properties for innovative use including  functional dielectrics;
  • Diagnostic and prognostic methods with a primary focus on the  behavior and properties of the electrical insulation in devices under operational stresses (the description of diagnostic methods without a primary link to the dielectric phenomena studied does not belong in  these Transactions).

Electret related papers fall within the scope of this journal and can include, but not limited to,

  • Charge related phenomena in dielectrics (injection, storage, transport, trapping, measurements)
  • Dielectric and space charge relaxations in polymers and organics
  • Dielectric and electrical responses of dielectrics to high electric fields
  • Dielectric relaxation spectroscopy
  • Energy storage in dielectrics and ionic materials
  • Thermally stimulated phenomena
  • Electrets for energy harvesting: principle, design, characterization and applications
  • Piezo-, pyro- and ferroelectrets
  • Electrocaloric and pyroelectric materials
  • Piezoelectric phenomena in polymers and organics/biomaterials
  • Applications of organic and polymer based piezoelectric materials
  • Electrets and functional polymers in organic electronics
  • Optical effects, photoelectrets
  • Electrostatic and dielectric phenomena in life sciences – bioelectrets
  • Soft transducers: sensors and actuators, including dielectric elastomers
  • Nanoscale electrostatic, dielectric and electret materials
  • Electret and dielectric phenomena in nanoscale structures
  • Bioelectrets and bioapplications
  • Electrets and additive manufacturing
  • Characterisation of electrets and related devices

Submission to Special Issue:

After a discussion with the Editor in Chief we are delighted to extend the deadline to 31 January, 2020 for full paper submission to the special issue of the IEEE Transactions on Dielectrics and Electrical Insulation: Electrets and Related Phenomena. Thanks to those who have already submitted their full papers. The Special Issue will be published in December 2020.

Papers are being sent for review as they are submitted after checking for relevance and compliance with the journal’s standard for manuscripts. This process will continue until the deadline for submission. Peer review process will follow the journal’s usual review standard. The extended deadline will allow ISE 2019 participants to engage during the Conference in deep scientific and technical discussions on the work presented and produce high quality manuscripts for the journal.

Guest Editors for this special issue are: Professor Sidney Lang (lang@bgu.ac.il), Professor Axel Mellinger (axel.mellinger@cmich.edu) and Professor Syed Tofail (tofail.syed@ul.ie).

Please submit your manuscript 2019, at the TDEI website (http://www.cloznet.com/ieeetdei). On the submission form please choose Syed/Lang/Mellinger – Electrets in the Guest Editor section.

Instructions for the preparation of manuscripts and a template are available at the TDEI website or directly from http://www.cloznet.com/ieeetdei/TDEI%20Template.docx

The template contains the formatting information etc.  Specifically, papers are limited to 8 pages, 25 references, and files not more than about 12 Mb. Papers must follow the template to be accepted for peer review.  The template can be downloaded from the paper submissions page. 

In accordance with IEEE policy, papers that have been previously published in any conference proceedings cannot be republished. A plagiarism tool will be used to verify originality. Authors must significantly expand and enhance their conference abstracts to be considered for publication in this Special Issue of the IEEE TDEI.

Further questions concerning this Special Issue should be directed to either one of the Guest Editors or directly to the Editor-in-Chief of the IEEE Transactions on Dielectrics and Electrical Insulation,  Professor Edward Cherney (edward.cherney@uwaterloo.ca). The Guest Editors for this special issue are: Professor Sidney Lang (lang@bgu.ac.il), Professor Axel Mellinger (axel.mellinger@cmich.edu) and Professor Tofail Syed (tofail.syed@ul.ie)